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QSil 550LV


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TDS
SDS
Description
Addition Cure Potting Material
Feature
  • No Solvent Added
  • Long pot life
  • Low modulus
  • Good Elongation
Code
QSil 550LV
Feature
Feature 1
No Solvent Added
Feature 2
Long pot life
Feature 3
Low modulus
Feature 4
Good Elongation
Color
Gray
Color A
Beige
Color B
Black
Cure Profile
30 mins at 100°C, 15 mins at 125°C, 10 mins at 150°C
Cure Type
Addition
Dielectric Constant
3.12
Dielectric Strength (V/mil)
539 V/mil
Dielectric Strength kV/mm
21.2 kV/mm
Dissipation Factor
0.003
Elongation at Break
85 %
Gel Time at 25°C/77°F
>24 hr
Hardness Shore A
58
Max Storage Temperature
38 °C
Max Working Temp
204 °C
Min Working Temp
-55 °C
Mix Ratio By Weight
1:1
Rheology
Liquid
RTV or Heat cure
Heat Cure
Shelf Life
24 mths
Specific Gravity A
1.41
Specific Gravity B
1.41
Tear Resistance (N/mm)
3.50 N/mm
Tensile Strength
2.97 N/mm2
Test Conditions
Cure 7 min at 150C and test at room temperature
Thermal Conductivity
~0.37 W/mK
UL 94V-0
3.0 mm
UL File No.
E205830
UL Listed
yes
Viscosity A
1,300 cP
Viscosity B
1,500 cP
Viscosity Mixed
1,400 cP
Volume Resistivity (Ohms cm)
1.46E+15 ohms cm
Youngs Modulus (N/mm2)
3.52 N/mm2
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